The team

Nokia's Network Infrastructure (NI) group is at the heart of a revolution to bring more and faster network capacity to people worldwide through our ambition, innovation, and technical expertise.

The Advanced Optics (AO) Team within NI designs high-performance optical front-end modules based on silicon-photonic integrated circuits (PICs), broadband Silicon Germanium Integrated circuits (TIAs and Drivers) and DSPs, within high-frequency packaging for coherent communication. The mission of the team is to bring these devices from an applied research stage all the way to volume production.

The Advanced Packaging team within AO is responsible for Package Design and various Product Packaging process steps, including wafer scale heterogenous integration and component level packaging, while working closely with our module and line card Packaging teams.

Broad Overview of Responsibilities

As a Senior Signal Integrity Engineer, you would be responsible to design the chain of interconnects for Nokia's fiber-optic transceiver products. You design, define, and guide implementation of hardware design, while considering technical limits and trade-offs of different Advanced Packaging platforms. In this role, you'll be working alongside experienced technical team leads and designers with strong records of delivering innovative photonic device designs into production.

• Own the high-speed Signal Integrity (SI) through all electro-optic components in our transmit and/or receive optical front-end modules, including PICs, RFICs, substrates and other package elements.
  • Modeling and Optimization of vias, connectors, sockets, breakouts and various system components in 3D Electromagnetic tools.
  • Contribute to the design of the broadband terminations of different driver/TIA configurations, under thermal and mechanical constraints potentially including on-PIC and/or off-PIC resistors, capacitors, and inductors.
  • Drive cross-functional discussions to analyze the full signal path from DSP ASIC, through the RF interface to the module, followed by the driver/TIA and Silicon-Photonic Integrated Circuit.
• Run simulations for RF radiation effects and other electromagnetic interference (EMI) issues between the multiple high-speed signals, high-resolution DAC/ADC signals and digital control signals (e.g., SPI).
• Analyze both differential and common-mode signals, with realistic signal patterns to/from DSP ASIC.
• Constant improvements of SI models using data from lab measurements and/or modelling tool/methodology updates
  • Substrate and board layout SI guidelines creation, review and post layout SI extractions
  • Simulation automation, data gathering, analysis and visualization using JMP, MATLAB or similar tools
  • Correlate simulations with lab measurements using high end PNAs, AWGs, Real Time Oscilloscopes and other typical SI test methodologies.
• Enhance designs with feedback from reviews in areas such as manufacturing, test, supply chain, reliability, industrial design and simulations.
• Use simulation and lab data to support design troubleshooting and propose corrective actions, drive failure analysis, root cause efforts and Design of Experiments (DOE) to resolve problems.
• Provide inputs for the development of next generation Advanced Packaging platforms.

Technical Skills

• An advanced degree in Electrical Engineering, Physics, Computer Science, or Mathematics
• 7+ years of experience in SI/PI simulations and measurements area
• Possess strong fundamentals in 3D/2D EM simulation tools, such as Q3D, HFSS, Ansys SiWave, PowerSI, CST, Cadence Sigrity, or others
• Experience with Keysight's Advanced Design Systems (ADS) tools
• A good grasp of fundamentals of circuit and electromagnetics theory including frequency and time domain analysis techniques, transmission line theory, termination techniques, generating and interpreting data-eye diagrams, bathtub curves with NRZ and PAM4 signaling techniques
• Good working knowledge of Board/Package/Substrate technology & designs, within fabrication limitations and cost trade-offs along with experience of high frequency PCB material
• Significant SI lab experience with TDR, VNA, oscilloscope and BERT measurements
• Experience working with PDN model extraction, simulation, and analysis
• Familiarity with a system level timing or loss budget including silicon, package and board impairments
• Good communications skills and ability to work with global teams is required

It will also be good to have:

• Familiarity with high-speed electro-optic hardware design, including an understanding of Fiber Optic Communication
• Experience with silicon-photonics technology

Scope & Contribution

Individual Contributor: Operates autonomously in own subject area. Can analyze, develop and implement concepts and solutions as a subject matter expert. Increased awareness of and involvement outside of own subject area. Distils big picture. Makes decisions about and prioritizes own work.

Innovation

Carries out specialised activities/projects according to general direction. Influences others to support decisions. Works mostly independently. Analyze situations or data that requires review of relevant factors. Solutions can often be checked and proved. Demonstrates success in multiple roles and is adaptable to manage complex changing business environments.

Communication

Communicates with parties within and outside of own job function and teams, and typically has responsibilities for communicating with parties external to the organisation, which may include customers or vendors. Works to influence others to accept job function's view/practices and agree/accept new concepts, practices, and approaches. Has cross-cultural knowledge and global mindset Requires ability to communicate with executive leadership regarding matters of significant importance to the organisation. May conduct briefings with senior leaders within the job function. May at times be required to negotiate regarding operational issues.